美國加州大學美熹德分校的楊明玄教授在3/26(週三)上午於陽明交大EC114室演講，歡迎踴躍參加，感謝您。

以下為演講資訊

 

Speaker: Prof. Ming-Hsuan Yang (UC Merced)
Talk title: Recent Results on 3D Vision in Dynamic Scenes
Time: 10:10 am -12:00 pm, March 26th, 2025
Location: EC114, NYCU (陽明交大工程三館114教室)

 

Abstract: Estimating geometry from dynamic scenes, where objects move and deform over time, remains a fundamental challenge in computer vision. Existing methods often rely on multi-stage pipelines or global optimization techniques that decompose the problem into subtasks, such as depth estimation and optical flow, resulting in complex systems prone to error propagation. In this talk, I will first introduce MonST3R, a novel geometry-first approach that directly estimates per-timestep geometry from dynamic scenes. Next, I will present NoPoSplat, a feed-forward model that reconstructs 3D scenes parameterized by 3D Gaussians from sparse, unposed multi-view images. Additionally, I will discuss FaceLift, an innovative feed-forward approach for rapid, high-quality 360-degree head reconstruction from single images. If time permits, I will highlight our Gaga framework, which reconstructs and segments open-world 3D scenes by leveraging inconsistent 2D masks predicted by zero-shot, class-agnostic segmentation models.
Bio: Ming-Hsuan Yang is a Professor at the University of California, Merced, and a Research Scientist at Google DeepMind. He has received numerous prestigious awards, including the Google Faculty Award (2009), the NSF CAREER Award (2012), and the Nvidia Pioneer Research Award (2017, 2018). He received the Best Paper Honorable Mention at UIST 2017, CVPR 2018, and ACCV 2018, the Longuet-Higgins Prize for Test of Time at CVPR 2023, and Best Paper at ICML 2024. Yang is an Associate Editor-in-Chief of IEEE Transactions on Pattern Analysis and Machine Intelligence (PAMI) and an Associate Editor for the International Journal of Computer Vision (IJCV). Previously, he was the Editor-in-Chief of Computer Vision and Image Understanding (CVIU) and  Program Co-Chair for ICCV 2019. He is a Fellow of IEEE, ACM, and AAAI.